Use of Modified Soy Adhesive for Manufacturing Fiberboard from Wood and OCC Fiber

Document Type : Research Paper

Authors

1 Wood and Forest Products Research Division, Research Institute of Forests and Rangelands, Agricultural Research, Education and Extension Organization (AREEO)

2 Research Institute of Forests and Rangelands, Agricultural Research Education and Extension Organization (AREEO), Tehran, Iran.

Abstract

Due to the environmental problems of formaldehyde gas emission, governments, manufacturers and scientific societies are looking for a solution to replace urea-formaldehyde adhesive by non-formaldehyde one for wood composites. So, this research was conducted on the feasibility of using old corrugated container fibers and tannin improved soy flour-based adhesive in green fiberboard production. For this reason, Tannic acid (as hydrolysable tannin) by 10 wt% was used as a modifier for soy adhesive and old corrugated container fibers were used in 0, 25, 50 and, 75 wt% based on the dry weight. The results of FTIR showed the chemical bonding between tannin ingredient and soy amino acids by forming a possible covalent bond. Also, the results showed that the physical and mechanical properties of manufactured raw fiberboard did not meet the EN 622-5 standard. Moreover, results indicated that this type of fiberboard needs more investigation, especially in the dry process. These manufactured boards have good potential to be used as a core material in wall and roof sandwich panels without any formaldehyde emission but more improvements are needed in physical and mechanical properties.

Keywords

References

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Iranian Journal of Wood and Paper Industries
Volume 12, Issue 2
September 2021
Pages 247-257

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